Chalco supplies aluminum thick plate for semiconductor equipment, focusing on 6061-T652 and 5083-O aluminum alloy forged plate for vacuum chambers, chamber lids, equipment bases, and large precision CNC-machined components. Large forged thick plates and custom blanks are available, while rolled and cast thick plate options can be evaluated based on project requirements.
For projects with requirements for thick-section machining stability, internal quality, and dimensions, Chalco supports drawing-based customization, saw cutting, and pre-machining. UT, mechanical property testing, and quality documentation can also be provided as specified in the order for equipment manufacturers and precision machining companies.
Semiconductor Aluminum Thick Plate Types & Grades
Chalco focuses on large 6061-T652 and 5083-O semiconductor forged plates, which can be customized according to component strength, corrosion resistance, machining method, and dimensional requirements. These products are part of Chalco's aluminum alloy thick plate range, with specific solutions evaluated against the drawings.
6061-T652 Semiconductor Forged Aluminum Thick Plate
6061-T652 is solution heat treated, stress relieved by compression, and artificially aged. It combines strength with suitability for machining and is suitable for large chambers and precision structural components. Thick-section forged plates and machining blanks can be supplied to drawings.
5083-O Semiconductor Forged Aluminum Thick Plate
5083-O is an annealed, non-heat-treatable alloy with good corrosion resistance and ductility. It is suitable for equipment structures and machining blanks with corresponding material requirements. Dimensions and machining allowances can be customized.
Other Semiconductor Forged Aluminum Alloys
For projects with special strength, corrosion resistance, or machining requirements, other forged plate alloys such as 3003 and 6082 can be considered. The actual temper, dimensions, and supply feasibility are evaluated according to the requirements.
In addition to forged plate, 6061-T651 rolled thick plate, 5083-series thick plate, and cast blanks can be evaluated. See the comparison below for guidance on selecting forged, rolled, or cast plate.
Semiconductor Aluminum Thick Plate Specifications & Size Ranges
Large forged plates and thick-section blanks in 6061-T652 and 5083-O can be customized to drawings. The following ranges and product examples apply to different production configurations.
| Specification Item | Reference Range | Notes |
| Alloy and Temper | 6061-T652, 5083-O | Core semiconductor forged plate materials |
| 6061-T652 (40 MN production configuration) | L100–4000 × W100–1600 mm | Individual piece weight <= 5 t |
| 6061-T652 (80 MN production configuration) | L100–4000 × W100–2000 mm | Individual piece weight <= 8 t |
| Large forged plate examples (L x W x T) | 2600 x 1800 x 520 mm; 3525 x 1585 x 252 mm; 1910 x 1172 x 485 mm | Examples from different actual production configurations; not universal dimensions for the full product range |
| Supply Forms | Full plate, custom blank, pre-machined blank | Evaluated according to drawings and machining allowance |
| Inspection and Quality Documents | UT, mechanical property, dimensional, and microstructure inspections | Standards, acceptance levels, and documentation requirements confirmed by project |
The 40 MN and 80 MN ranges above apply only to the listed 6061-T652 configurations in terms of length, width, and individual piece weight. Thickness and specific dimensional combinations require separate confirmation. Product examples from different production configurations also do not indicate that the same dimensions are available for both alloys.
Please confirm the available solution based on the drawing, temper, quantity, machining allowance, and acceptance requirements. Material solutions for ultra-thick aluminum plate can be evaluated separately according to project requirements.
Mechanical & Critical Material Properties
Forged plate for semiconductor equipment should be selected by considering strength, machining stability, surface quality, and acceptance conditions. The measured data below are for preliminary project evaluation only.
| 6061-T652 Forged Plate Test Results | ||||
| Alloy and Temper | Sampling Direction | Tensile Strength Rm (MPa) | Yield Strength Rp0.2 (MPa) | Elongation A (%) |
| 6061-T652 | L | 327 | 296 | 13.3 |
| 6061-T652 | LT | 320 | 290 | 12.0 |
| 6061-T652 | ST | 315 | 283 | 11.3 |
| The table shows measured reference values for a 6061-T652 forged plate sample in the L, LT, and ST directions. These are not guaranteed values for all sizes. For 5083-O, the applicable thickness, sampling direction, and mechanical property acceptance criteria can be confirmed according to project requirements. | ||||
Machining Stability
6061-T652 undergoes stress relief by compression, which can help reduce the risk of distortion during deep CNC machining of thick-section material. Actual results depend on the component geometry and the amount of material removed.
Anodizing & Surface Quality
The composition and second-phase microstructure of 6061 forged plate can be controlled to improve anodizing consistency. The specific appearance and surface performance should be confirmed according to the machining process and acceptance requirements.
If special performance or surface acceptance criteria are required, the specific requirements should be confirmed against the drawing, machining process, and order.
Forged vs Rolled vs Cast Aluminum Plate
Plate for semiconductor equipment should be selected from forged, rolled, or cast plate based on component dimensions, machining depth, internal quality, dimensional tolerances, and procurement cost. Each process has its own applicable boundaries, and the specific solution should be confirmed against the drawings and acceptance requirements.
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Forged Aluminum Thick Plate
Suitable for large thick sections, deep CNC machining, and blanks with higher internal-quality requirements. Dimensions, allowance, and UT conditions can be evaluated against drawings.
6061-T652, 5083-O
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Rolled Aluminum Thick Plate
Suitable for standard plate geometry, cut-to-size machining, and conventional equipment plates. Selection can be based on flatness, thickness tolerance, and machining requirements. See the 6061 tooling plate and block product.
6061-T651 and the 5083 series
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Cast Aluminum Thick Plate
Suitable for certain ultra-thick cut blanks or precision tooling applications. A sliced ingot is not equivalent to a low-stress precision cast tooling plate; delivery condition, surface, and internal quality should be confirmed according to the specific process.
5083-series and other confirmed available cast alloys
Forged Plate
Large thick sections / deep CNC machining
Rolled Plate
Standard plate geometry / cut-to-size machining
Cast Plate
Ultra-thick blanks / precision cast plate
Forged plate is generally evaluated first for large thick sections, deep CNC machining, and higher internal-quality requirements. Rolled plate can be considered for standard plate geometry and cut-to-size machining, while suitable cast plate can be evaluated for ultra-thick blanks or precision tooling. The final choice depends on component geometry, machining volume, and acceptance conditions.
Semiconductor Equipment Applications
Chalco supplies 6061-T652 and 5083-O semiconductor forged plates and custom blanks, with material solutions evaluated according to the dimensions, geometry, and machining requirements of the equipment component.
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Vacuum Chambers
Large chambers involve deep-cavity machining and substantial material removal, requiring higher internal quality and machining stability. 6061-T652 forged plate and custom blanks can be evaluated, with dimensions, machining allowance, and UT requirements confirmed against the drawing.
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Chamber Lids and Covers
Large covers often involve machining sealing surfaces and mounting holes, requiring control of allowance distribution and dimensional stability. 6061-T652 or 5083-O forged plate can be evaluated, with blanks customized according to the cover geometry and machining volume.
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Equipment Base Plates
Equipment bases typically involve large surfaces, flatness, mounting holes, and machining cost considerations. 6061-T651 rolled plate or custom forged plate can be evaluated based on geometry and acceptance requirements, with cut-to-size and pre-machining services available.
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Custom CNC-Machined Structural Components
Complex structural components require matching blank dimensions, machining allowance, and material temper to reduce material waste and machining risk. 6061-T652 and 5083-O forged plates and custom blanks can be evaluated, with the pre-machining plan confirmed against the drawing.
Semiconductor Equipment Component Gallery
Based on drawings for semiconductor chambers, lids, bases, and complex CNC-machined components, Chalco can match the alloy temper, blank dimensions, and machining allowance and supply forged plate and custom blanks. Chalco can also supply semiconductor sputtering targets for thin-film deposition and semiconductor bonding materials for packaging interconnects.
Manufacturing, Forging & Custom Blank Capabilities
Chalco can coordinate the supply process from material preparation, forging, and temper control through saw cutting and pre-machining, and can evaluate custom forged plate and blank solutions against drawings.
Melting, Casting & Material Preparation
Forging stock is prepared through melting, refining, degassing, filtration, homogenization, and related processes, providing a basis for subsequent microstructure and internal-quality control.
Large-Scale Open-Die & Closed-Die Forging
Production configurations including 100 MN, 80 MN, 45 MN, 40 MN, and 25 MN can be coordinated. Open-die forgings, closed-die forgings, and shaped blanks are evaluated according to component dimensions and geometry.
Heat Treatment & Stress Relief
6061-T652 is solution heat treated, stress relieved by compression, and artificially aged. 5083-O is supplied in an annealed condition. The specific process should be confirmed according to the alloy and order requirements.
Saw Cutting & Pre-Machining
Cut-to-size sawing, face milling, and pre-machining are available. Machining allowance can be reserved according to the drawing to provide blanks ready for subsequent CNC machining.
Custom Forged Blanks & Near-Net-Shape Options
Custom forged blanks and near-net-shape options can be evaluated against drawings to reduce unnecessary material removal. Feasibility depends on component geometry and process conditions.
The delivery form, machining depth, and feasibility of a near-net-shape option should be confirmed based on the drawing, alloy temper, blank dimensions, and purchase quantity.
Inspection, Quality Assurance & Traceability
For semiconductor forged plate, Chalco can coordinate chemical composition, mechanical property, microstructure, UT, and dimensional inspections according to the material, dimensions, and acceptance conditions, and can provide the corresponding quality documents.
- Chemical Composition Analysis: Verifies alloy composition against the applicable standard for grade and heat identification.
- Mechanical Properties Testing: Tests tensile strength, yield strength, and elongation as specified in the order. L/LT/ST sampling directions are confirmed where applicable.
- Macrostructure and Microstructure Inspection: Evaluates microstructure and internal quality through macro-etch, metallographic, or microscopic examination.
- Ultrasonic Testing (UT): Available for thick-section forged plate. The standard, inspection scope, and acceptance level are confirmed in the order.
- Dimensional and Surface Inspection: Verifies dimensions, machining allowance, and surface condition for acceptance of custom blanks.
- Material Traceability and Documentation: Supports heat and batch traceability and provides the MTC and relevant inspection documents as specified in the order.
UT acceptance level, sampling direction, inspection scope, MTC, and third-party inspection should be confirmed in the order or contract. Third-party inspection fees are subject to agreement.
Frequently Asked Questions (FAQ)
1. What Is the Difference Between 6061-T652 Forged Plate and 6061-T651 Rolled Plate?
6061-T652 forged plate is more suitable for large thick sections and blanks requiring deep CNC machining. 6061-T651 rolled plate is commonly used for standard plate geometry and cut-to-size machining. Selection should be based on thickness, internal quality, and machining requirements.
2. How Do I Choose Between 6061-T652 and 5083-O for Semiconductor Equipment?
6061-T652 emphasizes strength and suitability for precision machining, while 5083-O emphasizes corrosion resistance and ductility. The final grade should be confirmed based on component geometry, surface treatment, and operating environment.
3. Can Chalco Supply Saw-Cut or Pre-Machined Blanks for CNC Machining?
Yes. Chalco can supply cut-to-size, face-milled, and pre-machined blanks according to drawings. The specific allowance, blank condition, and machining depth should be confirmed before ordering.
4. What Are the Maximum Available Dimensions and Thicknesses for Semiconductor Forged Plates?
Available dimensions and thicknesses depend on the alloy, temper, individual piece weight, and production configuration and should be confirmed item by item against the drawing.
5. Can Chalco Provide UT Inspection, Mechanical Test Reports, and Material Certificates?
UT, mechanical property testing, and chemical composition analysis can be coordinated as specified in the order, with the corresponding MTC provided. The test standard, UT acceptance level, and sampling requirements should be defined before ordering.
6. Can I Order Small Quantities or Non-Standard Semiconductor Aluminum Forged Plates?
Small-batch and non-standard forged plate orders can be evaluated. The actual MOQ, production schedule, and lead time depend on the alloy, forging process, dimensions, and purchase quantity.
Request a Quote for Custom Semiconductor Aluminum Thick Plates
Chalco supplies 6061-T652 and 5083-O semiconductor forged plates and custom blanks. MOQ and lead time require order-specific confirmation, while packaging and international shipping can be coordinated.
Please provide the following information for a quotation:
Alloy and Temper: Alloy grade and required temper
Dimensions and Quantity: Length x width x thickness, quantity, or weight
Application and Drawings: Component application, drawings, and machining allowance
Standards and Inspection: Applicable standards, UT acceptance level, and inspection requirements
Delivery and Contact: Destination, expected delivery date, company, and contact details
Send Your Drawings and Specifications for a Material Review and Quote.
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