Aluminum and aluminum alloy sputtering targets are key metal thin-film materials used in semiconductor PVD processes. The main options include high-purity aluminum, AlCu, AlSi, and AlSiCu targets. The material system should be selected according to the target film composition, device structure, and process requirements.
We can supply 5N5-grade aluminum and aluminum alloy targets, with existing 6N high-purity aluminum product examples and a product base for 300 mm AlCu and AlSiCu targets. Supported by high-purity feedstock, alloy composition and grain structure control, precision machining, and target bonding capabilities, we can match monolithic or bonded structures to mainstream PVD systems, chamber configurations, and existing drawings. Support is available from specification confirmation and sample qualification through volume introduction.
Aluminum and Aluminum Alloy Sputtering Target Products
We can supply high-purity aluminum, AlCu, AlSi, and AlSiCu semiconductor sputtering targets. Product purity, alloy composition, dimensions, grain structure, and target construction can be confirmed according to the target film, PVD system, and existing process specifications.
High-Purity Aluminum Sputtering Targets
High-purity aluminum targets are suitable for semiconductor PVD projects with stringent requirements for film purity, critical impurities, and sputtering stability. Monolithic or bonded products can be provided to match the equipment configuration.
| Parameter | Available Range |
| Material | High-purity aluminum |
| Purity | Existing 6N product examples; other grades confirmed to specification |
| Dimensions | Confirmed according to the equipment, chamber, and drawing |
| Product Construction | Monolithic or bonded |
| Key Controls | Impurities, grain structure, dimensions, and surface quality |
AlCu Aluminum-Copper Sputtering Targets
Cu content and alloy uniformity in AlCu targets can be controlled according to the film design. These targets are suitable for semiconductor metallization projects requiring aluminum-copper alloy films.
| Parameter | Available Range |
| Material | AlSi aluminum-silicon alloy |
| Purity | 5N5 grade available; other grades confirmed to specification |
| Si Content | Confirmed according to the process specification |
| Dimensions | Customized according to the equipment and drawing |
| Product Construction | Monolithic or bonded |
| Key Controls | Si content, microstructural uniformity, and surface quality |
AlSi Aluminum-Silicon Sputtering Targets
AlSi targets emphasize control of Si content, alloy distribution, and microstructure. Specifications can be matched to the customer's existing film formulation and PVD equipment.
| Parameter | Available Range |
| Material | AlSi aluminum-silicon alloy |
| Purity | 5N5 grade available; other grades confirmed to specification |
| Si Content | Confirmed according to the process specification |
| Dimensions | Customized according to the equipment and drawing |
| Product Construction | Monolithic or bonded |
| Key Controls | Si content, microstructural uniformity, and surface quality |
AlSiCu Aluminum-Silicon-Copper Sputtering Targets
AlSiCu targets are suitable for aluminum-based alloy film projects with defined requirements for Si/Cu ratios and multielement uniformity. Alloy composition, grain structure, and target construction can be matched to the project.
| Parameter | Available Range |
| Material | AlSiCu aluminum-silicon-copper alloy |
| Purity | 5N5 grade available; other grades confirmed to specification |
| Si and Cu Content | Confirmed according to the film and process specifications |
| Existing Examples | 300 mm AlSiCu targets and monolithic product examples |
| Product Construction | Monolithic; bonded structures can be evaluated for the project |
| Key Controls | Multielement uniformity, grain structure, and process consistency |
Provide your alloy composition, purity grade, target dimensions, equipment model, and structural requirements, and we will use this information to match a suitable aluminum or aluminum alloy target solution.
Sputtering Target Dimensions and Structural Configurations
We can supply 300 mm AlCu and AlSiCu targets. Outer diameter, thickness, steps, backing plate, and mounting interfaces can be customized according to the PVD system, chamber, and cathode configuration. Monolithic, FSW-bonded, DB-bonded, and build-to-print options are available.
Target dimensions: Outer diameter, thickness, and assembly height confirmed from drawings
Product construction: Monolithic, FSW-bonded, or DB-bonded
Backing plate configuration: Material, dimensions, and cooling-side structure confirmed for the project
Machined profile: Steps, grooves, holes, and locating features
Surface requirements: Roughness, flatness, and cleanliness controlled to specification
Equipment matching: Evaluated according to the system model, chamber, and existing part number
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Circular Planar Aluminum Sputtering Target
For semiconductor wafer PVD. Diameter, thickness, and edge profile can be matched to the specific equipment interface.
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Monolithic Aluminum Sputtering Target
The target body uses a monolithic structure to reduce dissimilar-material interfaces. Existing product information includes a monolithic AlSiCu target example.
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Bonded Aluminum Sputtering Target with Backing Plate
FSW, DB, and other bonding options are supported. The backing plate and joint structure can be confirmed according to power, heat dissipation, and cathode design.
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Custom-Machined Aluminum Sputtering Target
Steps, grooves, mounting holes, locating features, and special edge profiles can be machined to an existing drawing for target replacement and equipment compatibility.
Semiconductor PVD Application Solutions
For wafer fabs, power semiconductor companies, MEMS manufacturers, and PVD equipment integration projects, we provide high-purity Al, AlCu, AlSi, and AlSiCu target solutions covering material composition, film performance, particle control, equipment compatibility, and supplier qualification.
Aluminum Metallization and Interconnect Films
Material matching:High-purity Al, AlCu, AlSi, and AlSiCu targets available
Microstructure control:Alloy composition, grain, and crystallographic orientation uniformity controlled
Defect management:Reduced risk of inclusions, particles
300 mm Wafer Production
Product support:300 mm AlCu and AlSiCu targets available
Lot control:Purity, alloy composition, and microstructure managed
Volume introduction:Sample, small-batch qualification, and specification control supported
Power Semiconductor, SiC, and GaN Devices
Structural matching:Monolithic, FSW-bonded, and DB-bonded options supported
Interface inspection:Bonding interface and joint integrity inspected
MEMS and Specialty Device PVD
Custom alloys:Cu and Si content matched to film requirements
Special machining:Steps, holes, grooves, and nonstandard profiles supported
Flexible supply:Sample trials and small-batch qualification supported
Equipment Matching and OEM Replacement
Equipment compatibility:Project evaluation for ULVAC, AMAT, EVATEC, NAURA, SPTS, and other systems
Specification matching:Dimensions, profiles, and backing plate structures matched to an existing part number or drawing
Stable Supply for Semiconductor Production
Specification management:Purity, composition, construction, and critical dimensions fixed
Supply support:Samples, small batches, volume production, and long-term procurement covered
Selecting Al, AlCu, AlSi, and AlSiCu Sputtering Targets
High-purity Al, AlCu, AlSi, and AlSiCu correspond to different aluminum-based thin-film systems. Selection should consider the target film composition, impurity control, device structure, PVD equipment, and existing process specifications.
| Selection Item | High-Purity Al | AlCu | AlSi | AlSiCu |
| Material System | High-purity aluminum | Aluminum-copper alloy | Aluminum-silicon alloy | Aluminum-silicon-copper alloy |
| Primary Positioning | Pure aluminum metallization film | Cu-containing aluminum alloy film | Si-containing aluminum alloy film | Multicomponent aluminum alloy film |
| Key Controls | Purity, critical impurities, and grain structure | Cu content, compositional uniformity, and grain structure | Si content, distribution uniformity, and microstructure | Si/Cu ratio and multielement uniformity |
| Specification Confirmation | Matched to purity grade and equipment configuration | Confirmed according to film formulation and process requirements | Confirmed according to film formulation and process requirements | Developed according to project composition and process window |
| Product and Project Examples | 6N high-purity aluminum target example | 300 mm product and ULVAC equipment matching example | AlSi target series available | 300 mm and monolithic target examples |
| Qualification Focus | Film purity, critical impurities, and lot stability | Alloy composition, microstructural uniformity, and equipment compatibility | Si distribution, microstructure, and film performance | Multielement composition, lot consistency, and process qualification |
The four material systems should be selected according to the target film formulation, device structure, PVD system, existing process parameters, and approved specifications. Provide the film composition, equipment model, and current target specifications, and we can help match an appropriate material system and qualification plan.
Product and Supply Advantages
- 5N5-grade aluminum and aluminum alloy targets are available, with support for 6N high-purity aluminum products.
- Coverage of four aluminum-based target categories: Al, AlCu, AlSi, and AlSiCu.
- 300 mm AlCu and AlSiCu semiconductor targets are available.
- Support for composition, grain, crystallographic orientation, and microstructural uniformity control.
- Monolithic, FSW-bonded, and DB-bonded target constructions are available.
- Replacement products can be developed from the PVD system model, chamber, existing part number, or drawing.
- Capabilities cover precision machining, bonding, cleaning, inspection, and vacuum packaging.
- Support for sample trials, small-batch qualification, OEM replacement, and volume supply.
Manufacturing Capabilities and Quality Control
From high-purity feedstock and alloy preparation through finished-product cleaning and vacuum packaging, we provide integrated manufacturing and quality management for aluminum and aluminum alloy sputtering targets. We also support sample qualification, OEM replacement, and second-source introduction.
Manufacturing Capabilities
Material and microstructure control: Support for magnetic levitation melting and IPAS grain and crystallographic orientation control
Precision finishing: CNC and turning capabilities for complex profiles and critical dimension control
Multiple target constructions: Monolithic, FSW-bonded, and DB-bonded products available
Clean finished-product delivery: Automated cleaning, drying, inspection, and vacuum packaging available
| Inspection Item | Inspection Method |
| Purity and trace impurities | ICP-MS |
| AlCu, AlSi, and AlSiCu alloy composition | XRF or chemical analysis |
| Grain size and crystallographic orientation | EBSD or metallographic examination |
| Bonding interface integrity | C-SCAN ultrasonic inspection |
| Dimensional and geometric accuracy | CMM inspection |
| Surface quality | Roughness, flatness, and cleanliness inspection |
Inspection items can be configured according to the customer's approved specifications, critical impurity requirements, target construction, and PVD qualification plan. Corresponding lot inspection and traceability documents can be provided.
Sample and Qualification Support
Replacement product development: Matching based on an existing part number, drawing, old target dimensions, or physical sample
Phased qualification: Support for sample trials, small-batch testing, and second-source qualification
Collaborative process adjustment: Product parameters optimized according to equipment feedback, film results, and service performance
Volume specification control: Material, construction, dimensions, and quality control items fixed after qualification
Project and Equipment Experience
300 mm project base: Support for the development and supply of 300 mm AlCu and AlSiCu targets
Mainstream equipment evaluation: Matching based on specific ULVAC, AMAT, EVATEC, NAURA, SPTS, and other system models and chamber drawings
Multi-stage project experience: International PVD equipment OEM projects, semiconductor volume-production customers, small-batch supply, and sample qualification projects
Provide the material system, alloy composition, equipment model, existing part number, and target drawing, and we can develop a sample manufacturing, inspection, and supplier qualification plan.
FAQ
1. What is the difference between Al, AlCu, AlSi and AlSiCu sputtering targets?
High-purity Al is primarily used to deposit pure aluminum metallization films. AlCu is used for Cu-containing aluminum alloy films, AlSi for Si-containing aluminum alloy films, and AlSiCu for multicomponent aluminum alloy films containing both Si and Cu. The specific material should be selected according to the target film composition, device structure, existing process recipe, and approved specifications.
2. What purity grades are available for aluminum sputtering targets?
We can supply 5N5-grade aluminum and aluminum alloy targets and support 6N high-purity aluminum products. The specific purity grade, critical impurity limits, and inspection items can be confirmed according to the semiconductor process specification, with corresponding lot inspection data provided.
3. Can the Cu and Si content of aluminum alloy targets be customized?
Yes. Cu and Si content and allowable tolerances can be confirmed according to the target film formulation, existing target specifications, and PVD qualification requirements. After sample qualification, the alloy composition, microstructure, and volume quality control requirements can be fixed.
4. Can you supply 300 mm aluminum alloy sputtering targets?
We can supply 300 mm AlCu and AlSiCu targets. The actual outer diameter, thickness, edge profile, backing plate, and mounting interface must be matched to the PVD system, chamber, and cathode configuration.
5. Are your aluminum targets compatible with AMAT, ULVAC and other PVD systems?
Compatibility can be evaluated according to the specific system model, chamber configuration, existing part number, and target drawing for AMAT, ULVAC, EVATEC, NAURA, SPTS, and other equipment. The existing product base includes a 300 mm AlCu project matched to ULVAC equipment; targets for other systems are developed to the applicable specifications.
6. Can you manufacture replacement targets from an existing drawing or used target?
Replacement products can be developed from the original part number, product drawing, old target dimensions, backing plate structure, or photos of an existing target. Monolithic, FSW-bonded, and DB-bonded options are supported, along with sample testing, small-batch qualification, and second-source introduction.
Submit Aluminum Target Drawings and Process Requirements
Provide the existing target information and PVD process requirements, and we can help confirm the material system, alloy composition, target construction, equipment compatibility, and sample qualification plan.
Target material: Al, AlCu, AlSi, or AlSiCu
Purity requirements: Purity grade and critical impurity limits
Alloy composition: Cu and Si content and allowable tolerances
Product dimensions: Diameter, thickness, and critical profiles
Equipment information: PVD system brand, model, and chamber model
Product construction: Monolithic, FSW-bonded, or DB-bonded
Backing plate configuration: Material, dimensions, and mounting drawing
Quality requirements: Grain, crystallographic orientation, surface, and cleanliness requirements
Replacement information: Existing part number, drawing, or photos of an old target
Procurement requirements: Sample quantity, qualification plan, and estimated annual volume
Even if the available information is incomplete, you can first submit the equipment model, original part number, or photos of the old target. We can use this information to identify the critical parameters and proceed with sample development.
Chalco can provide you the most comprehensive inventory of aluminum products and can also supply you customized products. Precise quotation will be provided within 24 hours.
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